Surface Mounted Technology Notes for CHIP-R and MLCC
C.T. LUH
Правила для деталей поверхностного монтажа (SMT). Подробно на примерах и в картинках описано и показано, как правильно выполнять работу.
Contents
Soldering Joint Criteria 2
Screen or Stencil Printing of Solder Paste
Placement Accuracy
Visual inspection of soldered joints
Guidelines for Footprint Design 7
Footprint design for Discrete CHIP-R / 8P4R Array Resistor
Footprint design for 10P8R network Resistor
Footprint design for Discrete MLCC / 8P4CArray Capacitor
Stencil thickness
Reflow soldering 11
Wave soldering 14
Adhesive and Adhesive Application 16
PCB design guidelines 18
Precaution of handling 21
Contents
Soldering Joint Criteria 2
Screen or Stencil Printing of Solder Paste
Placement Accuracy
Visual inspection of soldered joints
Guidelines for Footprint Design 7
Footprint design for Discrete CHIP-R / 8P4R Array Resistor
Footprint design for 10P8R network Resistor
Footprint design for Discrete MLCC / 8P4CArray Capacitor
Stencil thickness
Reflow soldering 11
Wave soldering 14
Adhesive and Adhesive Application 16
PCB design guidelines 18
Precaution of handling 21
კატეგორია:
წელი:
2002
გამომცემლობა:
Walsin Technology Corporation
ენა:
english
გვერდები:
21
ფაილი:
PDF, 2.86 MB
IPFS:
,
english, 2002
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